Highest output, highest ROI, highest flexibility, compact inline system
Unit-i4 is a new generation of selective wave soldering with the following features:
2 drop jet fluxers
Bottom IR preheating
2 solder pots in two individual wave tunnels, each with two wave tunnels
The PCB is moved by a conveyor, the conveyor table moves in X/Y, the solder pot/fluxer movies in Z
Windows 10 system
3-axis full servo drive with ball screw movement
Standard equipped with wave height calibration
Real-time soldering process monitor
Unit-i4 Specifications | ||
---|---|---|
Item | Unit-i4 | |
General | ||
Operating power/Max power | 6KW/22KW | |
Machine dimension | 1300(L)*1840(W)*1200(H) | |
Net weight | 700KG | |
Power supply | 3PH 380V 50HZ | |
Air supply | 3-5 bars | |
Exhausting required | 800M3/h | |
PC | Yes | |
Typical Program Time | 10 Minutes | |
Conveyor | ||
PCB dimension | W50xL50---W508xL508mm(single nozzle soldering) W50xL50---W508xL250mm(two nozzle soldering parally) W50xL50---W250xL250mm(four nozzles soldering parally) | |
PCB Clearance | Top 95mm bottom 30mm | |
PCB Weight | Max 5kg | |
Conveyor width | Auto | |
Conveyor assembling motion | X,Y motion with server motor/driver | |
PCB Robotic Platform | ||
Flux Nozzle Type | Drop jet fluxer | |
Flux Nozzle Quantity | 2 | |
Flux Tank Capacity | 1L | |
Flux Tank Quantity | 2 | |
Flux Nozzle Distance | adjustable | |
Preheat | ||
Preheating method | Bottom IR heater | |
Solder Management | ||
Solder pot type | mechanical pump | |
Standard Solder Stations | 2 | |
Solder Pot Capacity | 30 kgs | |
Solder Temperature Control | PID | |
Heat-UpTime | About 30mins | |
Max Temperature | 350 ℃ | |
Wave tunnel | 4pcs (2pcs per solder pot) | |
Mini Wave Nozzles | Dia 3to12mm | |
Customized nozzle | Available | |
Axes of Motion | Z1, Z2 | |
(N2) Inertion Management | ||
N2 Consumption per Nozzle | 6--8m3/H | |
Required N2 Purity | >99.99% |