Highest output, highest ROI, highest flexibility, compact inline system

    Unit-i4 is a new generation of selective wave soldering with the following features:

    2 drop jet fluxers

    Bottom IR preheating

    2 solder pots in two individual wave tunnels, each with two wave tunnels

    The PCB is moved by a conveyor, the conveyor table moves in X/Y, the solder pot/fluxer movies in Z

    Windows 10 system

    3-axis full servo drive with ball screw movement

    Standard equipped with wave height calibration

    Real-time soldering process monitor

Unit-i4 Specifications
    Operating power/Max power6KW/22KW
    Machine dimension1300(L)*1840(W)*1200(H)
    Net weight700KG
    Power supply3PH 380V 50HZ
    Air supply3-5 bars
    Exhausting required800M3/h
    Typical Program Time10 Minutes
    PCB dimensionW50xL50---W508xL508mm(single nozzle soldering) W50xL50---W508xL250mm(two nozzle soldering parally) W50xL50---W250xL250mm(four nozzles soldering parally)
    PCB ClearanceTop 95mm  bottom 30mm
    PCB WeightMax 5kg
    Conveyor widthAuto
    Conveyor assembling motionX,Y motion with server motor/driver
    PCB Robotic Platform
    Flux Nozzle TypeDrop jet fluxer
    Flux Nozzle Quantity2
    Flux Tank Capacity1L
    Flux Tank Quantity2
    Flux Nozzle Distanceadjustable
    Preheating methodBottom IR heater
    Solder Management
    Solder pot typemechanical pump
    Standard Solder Stations2
    Solder Pot Capacity30 kgs
    Solder Temperature ControlPID
    Heat-UpTimeAbout 30mins
    Max Temperature350 ℃
    Wave tunnel4pcs (2pcs per solder pot)
    Mini Wave NozzlesDia 3to12mm
    Customized nozzleAvailable
    Axes of MotionZ1, Z2
    (N2) Inertion Management
    N2 Consumption per Nozzle6--8m3/H
    Required N2 Purity>99.99%